PICMG 2 0 R3 0 EBOOK
PICMG 2 0 R3 0 EBOOK!

Comtel Electronics offers a large variety of CompactPCI Backplanes, 8 – 14 slots 64 bit 33Mhz, Fully compliancy with PICMG Rev Specs & AMC Rev. 11/15/06 Adopted. Defines a mezzanine building block approach for the addition of crucial functionality to a PICMG. Insertion of Front and Rear Boards. 22 Management Power .. similar in function to the K2 keying in PICMG R, Section


PICMG 2 0 R3 0 EBOOK

Author: Admin
Country: Lithuania
Language: English
Genre: Education
Published: 9 November 2014
Pages: 25
PDF File Size: 38.20 Mb
ePub File Size: 49.27 Mb
ISBN: 650-4-13724-602-2
Downloads: 91919
Price: Free
Uploader: Admin

PICMG 2 0 R3 0 EBOOK


It is electrically a superset of desktop PCI with a different physical form factor. Defined for both 3U mm by mm and 6U mm by mm card sizes. Members work collaboratively to develop new specifications and enhancements to existing ones.

"compactpci specification" products for embedded computing (50 found) - Embedded Computing Design

The members benefit from participating in standards development, gain early access to leading-edge technology, and forging relationships with thought leaders and suppliers in the industry. The organization's collaborations eventually expanded to include a variety of interconnect technologies for industrial computing and picmg 2 0 r3 0.

The open source groups tend to focus on specific product designs where even the Gerber files, schematics, and mechanical drawings are included. This lends itself to monochrome, commodity products with little differentiation.

Multiple vendors contribute to the base definitions and interfaces, but the implementation can vary greatly. VITA provides members with the ability to develop and to promote open technology standards. Since VITA's inception inVITA working groups developed specifications and standards important to designers of picmg 2 0 r3 0 embedded systems around the world.

PICMG 2 0 R3 0 EBOOK

Background[ edit ] PICMG is a leading standards development organization in the embedded computing industry. Members work collaboratively to develop new specifications and enhancements to existing ones.

The members benefit from participating in standards development, gain early access to leading-edge technology, and forging relationships with thought leaders and suppliers in the industry. The solder side cover is nominally 1mm thick.

PICMG 2 0 R3 0 EBOOK

Related Post